IEEE Future Networks Tech Focus
Volume 3, Number 1, March 2019 

In This Issue

• A Delay Modeling Framework for Embedded Virtual Network Function Chains in 5G Networks 
• 5G Wireless Modules Enabled by Additive Manufacturing Technologies 
• Millimeter-wave 3D-Printed Antenna Concepts for 5G Backhaul Links

 

A Delay Modeling Framework for Embedded Virtual Network Function Chains in 5G Networks 

Qiang Ye, Weihua Zhuang, Department of Electrical and Computer Engineering, University of Waterloo, Waterloo, Canada
Xu Li, Jaya Rao, Huawei Technologies, Ottawa, Canada

With the development of software-defined networking (SDN) and network function virtualization (NFV), software-defined topology (SDT) design poses technical challenges in embedding virtual network function (VNF) chains to minimize the embedding cost under packet delay constraints. In this article, we present a novel E2E delay modeling framework for embedded VNF chains to facilitate the delay-aware SDT design. A resource allocation policy called dominant-resource generalized processor sharing (DR-GPS) is applied among multiple VNF chains embedded on a common physical network path to achieve dominant resource allocation fairness and high system performance. An approximated M/D/1 queueing network model is then developed to analyze the average E2E packet delay for each traffic flow traversing an embedded VNF chain.

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5G Wireless Modules Enabled by Additive Manufacturing Technologies

Tong-Hong Lin, Jimmy G.D. Hester, Aline Eid, and Manos M. Tentzeris, Georgia Institute of Technology

Additive manufacturing technologies, including inkjet and 3D printing, display remarkable features that enable new and creative solutions to the challenges faced by 5G wireless systems. Their materials versatility and ability to seamlessly accommodate complex geometries open new opportunities in the areas of 5G-compatible mm-wave packaging and flexible, durable, and wearable 5G-enabled IoT systems. Their low tooling costs and rapid iteration capabilities also stand out in view of their use for large-scale quick-to-market fabrication of complex 5G devices, systems, and products. Here the authors demonstrate these capabilities by presenting examples of outstanding high-performance mm-wave 5G packaging, long-range RFID sensing systems, and wearable energy harvesters fabricated using low-cost additive manufacturing approaches.

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Millimeter-Wave 3D-Printed Antenna Concepts for 5G Backhaul Links

Nour Nachabe, Aimeric Bisognin, Diane Titz, Cyril Luxey, Polytech’lab, Université Nice Sophia-Antipolis, Frédéric Gianesello, STMicroelectronics,  Sérgio A. Matos, Jorge R. Da Costa, Instituto de Telecomunicações, Instituto Universitário de Lisboa, Carlos A. Fernandes, Instituto de Telecomunicações, Instituto Superior Técnico, Universidade de Lisboa, Carlos del Río Bocio, Universidad Pública de Navarra, Mahmoud Sawaby, Amin Arbabian, Stanford University

Increasing the area traffic capacity of the mobile network by adding small cells and re-organizing the radio access network is one of the most important milestones of the 5G deployment. The dense deployment of small cells, however, will put a tremendous burden on the backhaul intermediate links. To respond to this challenge, millimeter wave (mmW) wireless backhaul links are gaining prominence because of their ease of deployment and the large bandwidth they could offer to assure multi-Gb/s links. To achieve those requirements, leveraging 3D printing technologies to develop low-cost compact antennas for the mmW radios is rising as a promising solution.

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